3-D Engineering Corp Unveils New High Temperature Solder Side Covers
Temecula, CA, April 22, 2008 – 3-D Engineering Corporation, the leader in Innovation and Design Services unveils its High Temperature 6U x 160mm Compact PCI Solder Side Cover.
These covers are designed to meet the demanding requirements of high temperatures, ruggedized environments and outstanding performances.
FEATURES:
- MEETS UL94-V0 (FLAME RETARDANT)
- RUGGEDIZED FOR MILITARY APPLICATIONS
- NOMINAL THICKNESS .015
- ANTISTATIC
- CLEAR COLOR
- BAR CODE SCANABLE
- COMPLIANT WITH NEBS STANDARDS**
Availability and pricing:
In stock and ready to ship (Call for Pricing of Custom Sizes and Modifications)
SPECIFICATIONS:
COLOR CLEAR
THICKNESS .015 mil +.004 /-.002
STATIC DECAY <2.0>
ANTISTATIC PROPERTIES-ESD Coating
Our Products are used by:
- Telecommunication
- Printed Circuit Board Manufacturers
- System and Solution Providers
- Electronics and Contract Manufacturers
For more information on 3-D Products, go to:
http://www.3deng.com/Product.html
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